FEATURES

● Core: ARM^® 32-bit Cortex^®-M4 CPU

− 120 MHz maximum frequency, with a memory protection unit (MPU), single-cycle multiplication and hardware division

− DSP instructions

● Memories

− 16 to 64 KB of internal Flash memory

− 4 Kbytes of boot memory used as a Bootloader

− sLib: configurable part of main Flash set as a library area with code executable but secured, non-readable

− 8 to 16 Kbytes of SRAM

● Power control ( PWC)

− 2.4 to 3.6 V power supply

− Power-on reset (POR), low voltage reset (LVR) and power voltage monitoring (PVM)

− Low power modes: Sleep, Deepsleep and Standby modes; four WKUP pins used for wakeup from Standby mode

− Supports 5 x 32-bit battery powered registers (BPR)

● Clock and reset management ( CR M)

− 4 to 25 MHz crystal oscillator (HEXT)

− Internal 48 MHz factory-trimmed HICK (±1% at TA=25 °C, ±2% at TA= -40°C to +105 °C)

− PLL flexible 31 to 500 multiplication and 1 to 15 division factor

− 32 kHz crystal (LEXT)

− Low speed internal clock (LICK)

● Analog

− 1 x 12-bit 2 MSPS A/D converter, up to 15 input channels

− Temperature sensor (V_TS) and internal reference voltage (V_INTRV)

− 1 x CMP with 5 external input channels

● DMA

− 1 x 5-channel DMA controller

● Up to 28 fast GPIOs

− All mappable on 16 external interrupts (EXINT)

− Almost all 5 V-tolerant

● Up to 10 timers ( TMR)

− 1 x 16-bit 7-channel advanced timer, including 3 channels for complementary PWM output, with dead-time generator and emergency brake

− Up to 5 x 16-bit timers, each with 4 IC/OC /PWM or pulse counter and quadrature (incremental) encoder input

− 1 x 16-bit basic timer

− 2 x watchdog timers (general WDT and windowed WWDT)

− SysTick timer: a 24-bit downcounter

● ERTC: enhanced RTC, with alarm, subsecond accuracy, hardware calendar and calibration

● Up to 7 communication interfaces

− 2 x I²C interfaces (SMBus/PMBus)

− 2 x USARTs supporting master synchronous SPI and modem control, with ISO7816 interface, LIN, IrDA capability and swappable TX/RX

− 2 x SPIs (36 Mbit/s), all with multiplexed half-duplex I²S

− Infrared transmitter (IRTMR)

● CRC calculation unit

● 96-bit unique ID ( UID )

● Serial wire debug (SWD) interface

● Operating temperature: -40 to +105 °C

● Three-phase gate driver

− Integrated 90V half-bridge high side driver

− Ability to drive up to 3-phase half-bridge gates

− Built-in dead time control 0.5μs (typ.)

− Shoot-through protection

− Common-mode dV/dt noise cancellation circuit

− Tolerant of negative transient voltage

− Low dI/dt gate drive for better noise immunity

● Package Type

− LQFP48 7 x 7 mm

− QFN48 5 x 5 mm